AI Computing Optical Interconnection Wave is Coming｜Integrated Optoelectronics & Optical Communication Pavilion Unlocks New Opportunities for Optoelectronic Integration

 

As we enter the critical development cycle of China’s 15th Five‑Year Plan, optoelectronic integration and high‑speed optical interconnection have been listed as key R&D priorities for new‑type infrastructure and the digital economy. China keeps advancing the independent controllability of the optoelectronic industry chain, accelerating technological breakthroughs in high‑end optical devices and integrated photonics, and vigorously pushing for domestic chip substitution to consolidate the underlying foundation of the digital industry.

Multiple market dividends are converging at present. The continuous expansion of AI computing clusters drives iterative upgrades for high‑speed optical interconnection technologies. CPO/NPO co‑packaging, silicon photonics and thin‑film lithium niobate have become mainstream technical routes for computing‑power‑oriented optical interconnection. Meanwhile, specialty fibers keep expanding boundaries for high‑end scenarios, and automotive optical communication is seeing an industrialization window with the large‑scale roll‑out of intelligent vehicles. The optoelectronics industry is evolving from discrete device R&D toward system‑level integrated ecosystem competition. Upstream and downstream players across the industrial chain need professional platforms for technical exchange, supply‑demand matching and project implementation.

As an Asia‑Pacific benchmark event for the optoelectronics industry, Laser World of Photonics Shanghai 2027 proudly presents the Hall N1 · Integrated Optoelectronics & Optical Communication Pavilion. It focuses on seven core tracks: CPO/NPO co‑packaging, silicon photonics, thin‑film lithium niobate, specialty fibers, AI computing‑power optical interconnection, domestic chip substitution, and in‑vehicle optical communication. It serves as a top‑tier industrial hub featuring cutting‑edge tech exhibitions, in‑depth industry‑university‑research dialogues, and AI‑powered intelligent business matchmaking.

Technology is evolving at a rapid pace. Advantages held by leading enterprises are not permanent barriers. Now is a golden window for SMEs to achieve technological breakthroughs and for market leaders to consolidate their market position.

 

Five Core Advantages—Not to Be Missed

I. Rooted in East China's Photonics Hub: Direct Access to Upstream and Downstream Resources

Centering on Shanghai, Suzhou, Wuxi, Hangzhou, and Hefei, the Yangtze River Delta region accounts for over 60% of China's optical communication capacity. With a high concentration of silicon photonics and thin-film lithium niobate (TFLN) suppliers, a complete industrial loop—from wafers and photonic chips to packaging and high-speed optical modules—is achievable within a 100km radius. Suzhou hosts global optical module leaders, while Shanghai's Zhangjiang and Wuxi have established TFLN pilot lines. This proximity attracts a vast number of suppliers, foundries, and end customers to the exhibition.

II. Connecting Innovation Hubs: Bridging the "R&D – Pilot – Mass Production" Path

The Yangtze River Delta region clusters national-level photonics research platforms, as well as laboratories and pilot lines for TFLN, silicon photonics, quantum photonics, and high-speed coherent optical communications. Concurrent forums invite academicians, university professors, and pilot-line experts to empower industry-academia-research collaboration, process verification, and technology commercialization. Shanghai, Jiangsu, Zhejiang, and Anhui have listed integrated photonics, optical communications, and quantum technology as key industries in their 15th Five-Year Plans. The exhibition links industrial parks, sci-tech innovation funds, and industrial policies to help enterprises accelerate capacity deployment.

III. A 20+ Year International Platform: Driving the "Domestic Presence + Global Expansion"

Leveraging the deep heritage of the parent exhibition and the global Laser World of Photonics network, the exhibition has been rooted in China for 22 years. It has amassed over 200,000 professional visitors, covering the entire domestic optoelectronics industry chain and reaching 22 countries and regions. With over 71% of visitors from East China, it precisely targets the industry heartland. The upgraded XMatch business matching system enables 24/7 precise connections, providing a one-stop channel for both domestic presence and global expansion.

IV. Hall N1 + Prime Opening-Year Slot: Maximizing Brand Exposure

March is a critical industry kick-off, offering a golden window for companies to plan annual technology iterations, expand business, and finalize supply chain partnerships. Decision-makers, R&D engineers, and procurement heads all present. Located in the Hall N1—the high-traffic core—the exhibition features dedicated TFLN and quantum photonics zones. It serves as a benchmark for exhibiting next-generation integrated photonics in East China, boosting brand visibility and leadership.

V. Multiple Cutting-Edge Technology Forums: Building a Hub for Deep Exchange

Concurrent forums cover AI computing & optical interconnect, devices-to-networks collaborative innovation, and quantum computing & photonic chips, bringing together academicians, industry CTOs, research experts, and investors. Focusing on TFLN, silicon photonics integration, high-speed optical interconnects, automotive optical communication, and quantum photonics, the exhibition offers exclusive slots for corporate speeches and new product launches to enhance brand reach among technical decision-makers and R&D talent.

 

Exhibition Scope:

■ Integrated Photonic Chips – Core Foundation of Optoelectronics Convergence

Active device chips:

Laser chips (VCSEL, DML, EML, EEL, DFB), detector chips (PIN, APD), amplifier chips (LA, TIA, LD Driver), DSP chips, heterogeneously integrated optoelectronic chips.

Passive device chips:

PLC chips, AWG chips, optical switch chips, wavelength division multiplexing chips, TFLN modulator chips, silicon-based passive waveguide chips, photonic coupling chips.

■ Optical Components & Devices (Optoelectronic Packaging Integration)

Active optical devices:

VCSELs, semiconductor lasers, narrow-linewidth tunable light sources, DFB/EML lasers; optical amplifiers, semiconductor optical amplifiers; PIN/APD photodetectors; TOSA, ROSA, BOSA, coherent optical engines; LCOS spatial light modulators, high-speed electro-optic modulators.

Passive optical devices:

Fiber optic connectors, optical isolators, fiber couplers, PLC splitters, optical switches, WDM/DWDM devices, optical attenuators; ceramic sleeves, precision optical coupling assemblies, high-speed optoelectronic interconnect components.

■ Optical Modules (Core Optoelectronic Interfaces for Computing Networks)

100G/400G/800G/1.6T/3.2T short-reach & coherent optical modules, ultra-broadband AWG optical modules, pluggable optical modules, silicon photonics integration optical modules, co-packaged optics (CPO) optical engines, automotive optical communication modules.

■ Optical Fiber & Cable Industry Chain

Optical fiber preforms, fiber coating materials, fiber bragg gratings, fiber protective sleeves; single-mode/multi-mode fibers, erbium-doped fibers, hollow-core fibers, optoelectronic composite cables, submarine optical cables; optical crystals, optoelectronic thin films, bonded substrates, micro-nano optical materials, cable processing, fiber polishing, testing & inspection equipment.

■ System Equipment (Optoelectronics Convergence Application Terminals)

Optical communication transmission equipment

Optical circuit switches, optical transceivers, integrated optical distribution/transmission systems, silicon photonic coupling systems, optical transmitters.

Data center & computing network equipment

Ethernet switches, optical circuit switch cabinets, high-power optical amplification systems, PoE switches, industrial optoelectronic switching equipment.

Wires & cables

High-speed active cables, optoelectronic composite cables, coaxial cables, network patch cords.

■ Test & Measurement Instrumentation (Optoelectronic Performance Verification)

Optical network testers, optical spectrum analyzers, oscilloscopes, high-performance bit error rate testers, wavelength sweep test systems, optoelectronic network analyzers, signal quality analyzers, fiber fusion splicers, chip probe test systems.

■ Manufacturing Equipment & Process Support

Photonic chip manufacturing equipment:

Epitaxy equipment, lithography machines, etching machines, bonding equipment, wafer dicing equipment, coating equipment.

Optoelectronic packaging equipment:

Automatic eutectic die bonders, optical coupling machines, dispensers, die attach equipment, high-precision micro-assembly systems.

Semiconductor optoelectronic materials:

Indium phosphide, gallium arsenide, silicon-based materials, lithium niobate single-crystal thin films, photoresists, specialty adhesives.

■ Frontier Optoelectronic Convergence

Quantum photonic devices, microwave optoelectronic integrated systems, optoelectronic sensing chips, automotive high-speed optical interconnects, precision measurement photonic systems.

Grand Launch! Special Thin-Film Lithium Niobate (TFLN) Exhibition Zone

Core advantages: Relying on the existing optical equipment and laser industry, the zone achieves full-chain coverage from "material substrates – manufacturing equipment – chip devices – scenario applications," becoming a domestic full-chain lithium niobate exhibition area.

Concurrent Events on Integrated Photonics and Optical Communication

As the restructuring driven by large AI models breaks through traditional bandwidth bottlenecks, competition in the optical communication industry has shifted from a single device to system synergy. This year's Laser World of Photonics Shanghai plans to deeply deconstruct the core issues of the optical communication industry chain: from breakthroughs in silicon photonics integration and CPO to the architectural reshaping of AI computing networks and the rapid translation of cutting-edge research into practical outcomes, creating a full-scenario technology feast.

The 2026 Integrated Photonics and Optical Communication event spanned 2.5 days, featuring 3 themed events, 19 high-quality keynote speeches, 15 new product roadshows, and 1 in-depth roundtable discussion, achieving an overall satisfaction rate of 95%.

In 2027, the event will continue to expand in breadth and depth, with academic conferences, professional forums, and new product roadshows working in synergy to provide a platform for in-depth industry-academia-research dialogue from optoelectronic chips to intelligent computing centers.

 

Core Event Themes:

AI Computing & Optical Interconnect Forum

Silicon Photonics Integration & Optoelectronics Convergence Forum

New Products and Application Innovations Launch

 

Enquiries

Contact: Ms. Kong

Tel.: +86 21-20205652

E-mail: karyn.kong@mm-sh.com