Time:March 19, 2026
Venue:Forum Area at Hall N5, Shanghai New International Expo Centre (SNIEC)
Fee:Free
Language: Chinese
Organizers:
ICC
Messe Muenchen Shanghai Co., Ltd.
Agenda:
|
Time |
Topics |
Speakers |
|
10:00-10:10 |
开场介绍 |
ICC communication |
|
10:10-10:35 |
New Reflections on the Integrated Development of Cloud and Network in the Intelligent Computing Era |
王东,中国移动研究院,主任研究员 |
|
10:35-11:00 |
Optical Devices and Subsystems in the AI Super Cycle |
吕名扬,NOKIA诺基亚光网络事业部,首席架构师 |
|
11:00-11:25 |
Development Trends and Key Technologies of Optical Interconnect Chiplets |
李淼峰,奇点光子,联合创始人&CTO PhotonicX AI |
|
11:25-11:50 |
AI Computing Power-Driven: Evolution and Development Trends of Optical Communication Technologies |
吴军,ICC讯石产业研究院,光通信行业专家 |
|
11:50-13:30 |
Lunch break |
|
|
13:30-13:55 |
Development of AI Computing Power Optical Network |
马黄旭,Kuaishou快手科技,光网络架构师 |
|
13:55-14:20 |
CPO: Challenges and Opportunities of the Last Meter |
阮祖亮,H3C新华三集团,光模块系统架构师 |
|
14:20-14:45 |
Opportunities and Challenges of Optical Modules in the Computing Power Era |
吴晟,Taclink德科立,光模块事业部产品总监 |
|
14:45-15:10 |
Micro-Optics Without Limits: Varied Technologies, Powerful Datacom Solutions |
田勇, Focuslight炬光科技,激光光学事业部副总经理 |
|
15:10-15:35 |
Optical Interconnection: The Inevitable Path for the Development of Super Nodes |
孟怀宇,Lightelligence曦智科技,联合创始人&首席技术官 |
|
15:35-17:00 |
Discussion:Look forward to the Applications of Next-Generation Optical Interconnection Technologies Topic: 1. NPO/CPO technical standards, application scenarios and commercialization forecasts 2. Chiplets optical interconnection technology form – Development of optical I/O inter-die interconnection 3. Trend of super nodes in computing power clusters |
|
For most updated information, please refer to the conference schedule posted.
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