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From Devices to Networks: Collaborative Innovation Forum

TimeMarch 18, 2026

VenueForum Area at Hall N2, Shanghai New International Expo Centre (SNIEC)

FeeFree

LanguageChinese

 

Organizers

Semi-insights.com

Messe Muenchen Shanghai Co., Ltd.

 

Agenda:For most updated information, please refer to the conference schedule posted.

Time

Topics

Speakers

9:00-10:00

Sign in

10:00-10:10

Welcome Speech

10:10-10:35

Optoelectronic Convergent Integrated Chips and Devices for Information and Communication Systems

rofessor Zhou HengUniversity of Electronic Science and Technology of China

10:35-11:00

Silicon Photonics: The Engine Behind High-Performance AI Optical Interconnects.

Liu JingweiChina Science Photon Chip (Haining) Technology Co., LtdChairman

11:00-11:25

Born for high frequency and high reliability : The technical advantages of silicon capacitors in AI applications and optical

Da Xiang, WangShanghai Launchip Technology Co., LtdGM

11:25-11:50

Building the Visual Infrastructure for the Era of the Internet of Everything

Deptrum Lyu fanglu, Co-FounderCOO

11:50-13:30

Lunch time

13:30-13:35

Introduction

13:35-14:00

Building a New Paradigm of Computing Power through Optoelectronic Convergence

Wang Jingtian , Shanghai Lightelligence Inc.,Vice President

14:00-14:25

2.5D/3D EDANew Paradigm - Advanced Packaging : architecting & physical implementation, simulation, and testing

Alex Zhao (PhD), Zhuhai Silicon ChipTechnology Ltd., Founder & General Manager

14:25-14:50

Silicon Photonics Technology for AI Clusters

Chen Qi ,Shanghai Bopu Semiconductor Technology Co., Ltd., Director of Chip Design

14:50-15:15

Photonics chip platform for AI and quantum computing

Levy ,TuringQ Co.,Ltd, coo

15:15-15:40

Applications and Future Test Solutions for Optical Domain Oscilloscopes

Qiu Xiaoyong ,Shenzhen Wanliyan Technology Co., Ltd. ,Chief Technical Expert of Wanliyan High-Speed Testing

15:40-16:00

Q&A and Podium Discussion