The Forum of Precision Testing Technology for Integrated Circuit

Time

Topics

Speakers

09:00-10:00

Sign in

10:00-10:25

Current status and challenges of traceable metrology technology in semiconductor manufacturing processes

Dr. Lin Yang,the director of Dimension and Mechanics Metrology Division at CEPREI Calibration and Testing Center.

10:25-10:50

Research and Application of Key Technologies for High-Speed, High-Precision 3D Inspection in Chip Packaging

Yixin Xu, Illumineer Tech(Shanghai) Co., Ltd., Founder

10:50-11:15

Empowering AR/VR Smart Displays: Defect Inspection Technologies and Equipment for Transparent Wafers

Weiyang Yu, ZC Optoelectronic Technology Co., Ltd. ,  General Manager

11:15-11:40

基于二维材料的感-存-算芯片研究

He Tian, Tsinghua University

11:40-14:00

Lunch

14:00-14:25

Nanometrology and Applications of the Quantized Optical-Lattice Constant

Xinbin Cheng, Tongji University / National Integrated Circuit Micro-Nano Inspection Equipment Industrial Metrology and Testing Center (Shanghai), Dean of School of Physical Science and Engineering, Tongji University

14:25-14:50

In-line critical dimension metrology for IC nanostructures

Xiuguo Chen, Huazhong University of Science and Technology, Professor

14:50-15:15

Large‑Aperture High‑Precision Interferometric Testing Technology and Instruments

Zhigang Han, Nanjing University of Science and Technology, Researcher

15:15-15:40

A Brief Discussion on Path Optimization for Integrated Circuit Testing in High-Reliability Applications

Mingqi Pang, CASIC Defense Technology Research and Testing Center, Supervisor